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History

History also including the device achievement of Oki Electric Industry Co., Ltd. which is the predecessor of OKI SEMICONDUCTOR CO., LTD.

:Facilities :Technologies/Products

1961 Building No.1 completed
Production of transistors
1962 Building No.2 and No.3 completed
Production of millimeter wave tubes and electronic computers
1965 Production of reed relays / Development of ICs started
1966 Production of reed switches
1967 Production of ICs
1968 Development CMOS ICs started
1969 Building No.4 completed
Production of printed circuit boards
1975 (Operations begun at Chichibu plant)
Production of 4Kb DRAM
1977 VLSI Laboratory No.1 completed
Production of microprocessors
1979 Production of microcomputers
1980 Administration/Technology Center completed
1981 (Operations begun at Miyazaki Oki Electric)
Production of gate arrays and 64kb DRAMs (3μm design rules used)
1982 Technology transfer to National Semiconductor Inc.
1983 VLSI Laboratory No.2 completed
(M2 Plant completed at Miyazaki Oki Electric)
1984 (Oki Micro Design Miyazaki established)
Production of 256kb DRAMs (2μm design rules used)
1985 VLSI Laboratory No.3 completed
1987 Production of 1Mb DRAMs (1.2μm design rules used)
1988 (Operations begun at Miyagi Oki Electric)
1989 Production of 4Mb DRAMs (0.8μm design rules used)
1990 (Operation begun at Oregon Plant in U.S.)
(Oki LSI Technology Kansai established)
1991 (M3 Plant completed at Miyazaki Oki Electric)
1992 (Operations begun at Thailand Plant)
ULSI Laboratory No.1 completed
Production of 16 Mb DRAMs (0.5μm design rules used)
1994 256Mb DRAMs (0.25μm design rules used) successfully developed
1995 (S2 Plant completed at Miyazaki Oki Electric)
Production of SSD cards
1996 New Cafeteria Building completed (Building No.6)
1997 New Administration/Technology Center completed (Building No.7)
Production of 64Mb DRAMs (0.3μm design rules used)
1Gb DRAMs (0.18μm design rules used) successfully developed
1998 Business based SPA started
Surface-mount Optical Network Modules commercialized
USB Control LSIs commercialized
2000 Bluetooth System LSIs commercialized
μPLAT developed
2002 Production of LSIs using Fully Depleted SOI-CMOS technology
2003 Long-Wave Time Code Receiver based on SOI-CMOS technology successfully developed, an industry first
2004 Semiconductor Bases in Shenzhen, Beijing and Shanghai established
2005 Semiconductor Business Group established
2007 Silicon Microdevice Company established
2008 OKI SEMICONDUCTOR CO.,LTD. established