Research and Development

Creation of Differential Products and Technology

We are working on development of competitive system LSIs for the coming ubiquitous network era by pursuing the feasibility of LSI technology and OKI SEMICONDUCTOR-unique technology. Typical themes include SOI device technology, MEMS sensor technology capable of achieving multi-functionality and high-integration, and three-dimensional mounting technology.

SOI Technology

The complete depletion type SOI (Silicon On Insulator) can achieve high-speed operation and low power consumption by forming devices on a super-thin silicon substrate.  We have started volume-production and shipment of LSIs using complete depletion type SOI technology for the first time in the world for consumer products.  We will continuously promote the application of such LSIs in the mobile personal devices by fully utilizing the high-speed operation and low power consumption performance.  Since the elements of the SOI devices are completely separated in structure, SOI has excellent radiation resistance. Using this advantage, we will promote its application to aerospace equipment as SOI-FeRAM mixed LSIs in combination with nonvolatile memories.

Three-Dimensional Mounting Technology

50μm-Thick 10-Layer Lamination

Three-dimensional mounting technology enables lamination of only 50µm-thick chips using penetration electrodes formed on a silicon substrate.  Since multiple chips can be mounted in a single package by stacking them, we can quick meet future requirements for large-capacity memories.  Short inter-chip distance is also suitable for devices which require high-speed operation.  As a cutting-edge high-density mounting technology achieving minimal mouting volume despite its high speed and large capacity features, we will apply this technology to large capacity memories and logic devices of mobile personal equipment.