IC Packages

More Value-Added Application Technology
--OKI's IC Package Technology --

The objectives of the existing IC package technology are to protect the main body of ICs from external environment and to mount ICs on boards. Currently, high-value addition is requested to the package itself for effective mounting as a result of the expansion of the application fields of IC products and diversified package materials, sizes, and shapes. Therefore, in the IC development, package technology has been paid attention to as a strategically important technology as well as design technology and process technology. OKI contributes to customers with a wide array of package lineup and reliable technology based on the past performance which has been achieved by our active efforts in development of the package technology.

New Package

1. >LSI Package Roadmap
2. >W-CSP(Wafer Level Chip Size Package)
3. >FBGA(Fine-pitch Ball Grid Array)/FLGA(Fine-pitch Land Grid Array)
4. >TCP(Tape Carrier Package)/COF(Chip On Film)
5. >Lead-free