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W-CSP
Overview
The wafer level CSP is the world's smallest ultra miniature package developed to meet the requirements for high performance and downsizing typically by mobile equipment.
OKI provides strong support for customers' excellent product development by carrying out development based on the package technology cultivated for our own semiconductor devices and expanding foundry services for cutting-edge packages.
Features
• Ultra Miniature, Light Weight
·Achieved epoch-making miniature packages; 10% in mounting area and 10% in weight (*1) compared with conventional packages
Comparison between TQFP and WCSP
|
Package Size (mm2) |
Mounting Area
(mm2) |
Pin Pitch
(mm) |
Weight
(g) |
 |
14X14 |
256 |
0.5 |
0.26 |
|
5X5 |
25 |
0.5 |
0.03 |
*1:Compared with OKI's 100-pin TQFP
• Ultra Thin Type
·Achieved 0.5mm thickness (typ.) for LGA. 0.4mm thickness (typ.) is also possible.
• Ease of Handling
·The plastic sealing on the device surface enables installation with batch reflow equipment in the same way as for existing packages.
·Excellent reflow resistance (JEDEC level 1) is achieved with material/process technologies.
• Electrical Characteristics
·The control of wiring width and wiring length enables achievement of excellent electrical characteristics.
Applications
Semiconductor devices for compact and light-weight equipment such as mobile phones, PDAs, DSCs, and cards
Reliability Evaluation Results for Reference
| High-temperature operation test (Ta : 125°C,VDD : 3.6V) |
1000H Pass |
| High-temperature storage test (Ta : 150°C) |
1000H Pass |
| High-temperature high-humidity bias test (Ta : 85°C,RH : 85%,VDD : 3.6V) |
1000H Pass |
| Vapor unsaturation pressure test (Ta : 121°C,RH : 85%) |
300H Pass |
| Temperature cycle test (-65°C~RT~150°C) |
500cyc. Pass |
Specifications
Item |
Specifications |
| Wafer diameter | 6 in., 8 in. |
| Pin material | Eutectic, Pb-free |
| Pin shape | LGA, BGA |
| Pin pitch | LGA:min. 0.3mm, BGA:min. 0.5mm |
Please contact us for further details.
Support
For customers to accelerate development and achieve volume production target, OKI provides strong supports:
- Quick response through direct access to our key persons for individual items
- Support for heat resistance analysis and electrical characteristics analysis
