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FBGA/FLGA
Features and Appealing Points
Packages where a semiconductor chip is mounted on the glass epoxy substrate and is sealed with transfer mold after circuit wiring by wire bonding.
The pins are arranged on the bottom surface of the substrate in an area form.
OKI recommends FLGA using solder/Pb-free coated pins for packages with an external size of 10mm or less and FBGA using solder/Pb-free balls with an external size exceeding 10mm.
In each package, MCP (Multi Chip Package) using lamination structure can also be supported.
Examples of Packages
Lineup
FBGA Family
Package Size |
Pin Count |
Pin Pitch |
Pin Arrangement |
Package Code |
Status |
|
6X6mm |
60pins |
0.5mm |
2 rows in periphery |
P-LFBGA64-0606-0.50 |
Volume production |
|
7X7mm |
48pins |
0.8mm |
2 rows in periphery |
P-LFBGA48-0707-0.80 |
|
|
8X8mm |
160pins |
0.5mm
|
4 rows in periphery |
P-TFBGA160-0808-0.50 |
|
|
9X9mm |
84pins |
0.8mm |
3 rows in periphery |
P-LFBGA84-0909-0.80 |
|
|
9X9mm |
120pins |
0.65mm |
3 rows in periphery |
P-TFBGA120-0909-0.65 |
|
|
11X11mm |
144pins |
0.8mm |
4 rows in periphery |
P-LFBGA144-1111-0.80 |
|
|
11X11mm |
176pins |
0.65mm |
4 rows in periphery |
P-LFBGA176-1111-0.65 |
|
|
13X13mm |
144pins |
0.8mm |
3 rows in periphery |
P-LFBGA144-1313-0.80 |
|
|
13X13mm |
224pins |
0.65mm |
4 rows in periphery |
P-LFBGA224-1313-0.65 |
|
|
15X15mm |
224pins |
0.8mm |
4 rows in periphery |
P-LFBGA224-1515-0.80 |
FLGA Family
Package Size |
Pin Count |
Pin Pitch |
Pin Arrangement |
Package Code |
Status |
|
7X7mm |
48pins |
0.8mm |
2 rows in periphery |
P-TFLGA48-0707-0.80 |
Volume production |
|
8X8mm |
56pins |
0.8mm |
2 rows in periphery |
P-TFLGA56-0808-0.80 |
|
|
9X9mm |
84pins |
0.8mm |
3 rows in periphery |
P-TFLGA84-0909-0.80 |
