Structure

Packages where traces are formed on a flexible tape using photolithograph technology and a semiconductor chip is mounted on the tape carrier using TAB (Tape Automated Bonding) technique.

Material thickness has been reduced to allow supply of COF packages which support fine pitches.

Appealing Points

1.Patterning is applied to a tape substrate using thin copper foil, pin formation of 40μm and that of 35μm or less are possible for TCP (Tape Carrier Package) and COF (Chip On Film), respectively.

2.The package thickness can be reduced to 1mm or less since IC chips are mounted directly on a tape substrate.

3.Flexible structure of TCP allows fold-mounting.
COF can be freely fold-mounted except its plastic sealed section.

Photograph

642-Output LCD Source Drive TCP

256-Output LCD Gate Drive COF