This website is displayed in a mode compatible with Internet Explorer 4 or earlier, Netscape 4.7 or earlier, and text browsers. (About display mode)

Semiconductor Business Group Supplies semiconductors and related services valuable to customers specialized in developing or manufacturing personal or mobile equipmemt.

Inquiries, FAQ | Site map | User Registration

Semiconductor Business Group Home > Packages > NewPackage > Lead-free products

Lead-free products

Packages
NewPackage
W-CSP
FBGA/FLGA
TCP/COF
Lead-free products

Features and Appealing Points

1.Lead (Pb) is not used inside the package nor at the pins.

2.A reflow temperature of 260°C is permitted for the heat resistance temperature of surface-mount packages (SMD).

3.For the pins, "Lead frame type: Sn-Bi" and "BGA type: Sn-Ag-Cu" are used.

Development Policy

1.Implementation to all the products became possible in FY2003.

2.Shipment of lead-free products can be made as soon as approval is obtained for each product.

3.Lead-free products are differentiated from existing products.

4.With respect to requests for lead-contained products, production of existing products (lead-contained products) will be continued for the time being.