OKI's semiconductor integrated circuits have been named based on the classification by the process class emplyed, e.g, MSM, MSL, and MSC. However, with the recent increase in the number of types and the increase in the length of function indications due to enhancement of functions, operation under the existing naming rules has become difficult. For these reasons, the product naming rules have been changed as shown below. We appreciate your understanding and cooperation. For upgrading of new code products such as gate arrays and mask ROMs, the new rules will be applied to the package symbols and option codes only.

The names of the existing products remain unchanged.

Structure of Product Name

(1) Device function

Device functions are classified as follows: MD: DRAM
MR: EEPROM, Mask ROM, OTPROM, EPROM
MS: SRAM, VRAM, FIFO
MG: Gate Array, Standard Cell
ML: Logic
MK: Module, Chip Set

(2)Device code

A device code expresses a function specific to the device using a combination of numbers and alphanumeric characters.

(3)Character symbol

A character symbol is added to indicate modification of an existing product or to emphasize specification which differs from the standard specification of an existing product.

(4)Derived code

A device code indicates a speed ranking for DRAMs, SRAMs and memory module devices, and is used as a derived code for Mask ROMs and logic devices.

(5)Package symbol

A package symbol expresses the type and lead bending profile of a package in two digits.

(6)Option classification symbol

An option classification symbol is used to distinguish between an option symbol and a package symbol.

(7)Option code

An option code indicates a symbol which identifies the specification pf a product provided with an option.