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Semiconductor Business Group Home > Integrated Circuits > P2ROM/OTP > OTP ROM

OTP ROM

Standard OTPs3.3V Page Mode OTPs

Standard OTPs

Capacity Part
Number
Configuration Supply
Voltage
(V)
Access
Time
(ns)
Operating
Current
(Max.)
Standby
Current
(Max.)
Package
256M MR26V25605J* 8M X 32, 16M X 16 3.0 to 3.6 90 60mA 50μA 70SSOP*1
64M MR27V6402G
Data sheet[PDF]
4M X 16, 8M X 8 3.0 to 3.6 80 20mA 10μA 44SOP 44TSOP(2) 48TSOP(1)
32M MR27V3202F
Data sheet[PDF]
2M X 16, 4M X 8 3.0 to 3.6 90 20mA 50μA 44SOP 44TSOP(2) 48TSOP(1)
16M MR27V1602F
Data sheet[PDF]
1M X 16, 2M X 8 3.0 to 3.6 80 16mA 10μA 44SOP 48TSOP(1)
8M MR27V802F
Data sheet[PDF]
512K X 16, 1M X 8 3.0 to 3.6 70 18mA 5μA 44SOP 44TSOP(2) 48TSOP(1)

*: Under development
*1: For sockets. Package is not suitable for reflow soldering.

 

Standard OTPs3.3V Page Mode OTPs

3.3V Page Mode OTPs

Capacity Part
Number
Configuration
(words/PAGE)
Supply
Voltage
(V)
Access
Time
(Address/Page)
(ns)
Operating
Current
(Max.)
Standby
Current
(Max.)
Package
256M MR26V25655J* 16M X 32 32M X 16 8-word 3.0 to 3.6 120/35 100mA 50μA 70SSOP*1
128M MR27V12850J* 8M X 16 16M X 8 8-word 3.0 to 3.6 100/25 50mA 10μA 48TSOP(1)
64M MR27V6452G* 4M X 16 8M X 8 8-word 3.0 to 3.6 100/30 50mA 10μA 44SOP/48TSOP(1)
32M MR27V3252J
Data sheet[PDF]
2M X 16 4M X 8 8-word 3.0 to 3.6 70/25 50mA 10μA 48TSOP(1)

*: Under development
*1: For sockets. Package is not suitable for reflow soldering.

 



 

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