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OKI SEMICONDUCTOR > Company > History
:Facilities
:Technologies/Products
| 1961 |
Building No.1 completed |
Production of transistors |
|
| 1962 |
Building No.2 and No.3 completed |
Production of millimeter wave tubes and electronic computers |
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| 1965 |
Production of reed relays / Development of ICs started |
| 1966 |
Production of reed switches |
| 1967 |
Production of ICs |
| 1968 |
Development CMOS ICs started |
| 1969 |
Building No.4 completed |
Production of printed circuit boards |
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| 1975 |
(Operations begun at Chichibu plant) |
Production of 4Kb DRAM |
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| 1977 |
VLSI Laboratory No.1 completed |
Production of microprocessors |
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| 1979 |
Production of microcomputers |
| 1980 |
Administration/Technology Center completed |
| 1981 |
(Operations begun at Miyazaki Oki Electric) |
Production of gate arrays and 64kb DRAMs (3μm design rules used) |
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| 1982 |
Technology transfer to National Semiconductor Inc. |
| 1983 |
VLSI Laboratory No.2 completed |
(M2 Plant completed at Miyazaki Oki Electric) |
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| 1984 |
(Oki Micro Design Miyazaki established) |
Production of 256kb DRAMs (2μm design rules used) |
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| 1985 |
VLSI Laboratory No.3 completed |
| 1987 |
Production of 1Mb DRAMs (1.2μm design rules used) |
| 1988 |
(Operations begun at Miyagi Oki Electric) |
| 1989 |
Production of 4Mb DRAMs (0.8μm design rules used) |
| 1990 |
(Operation begun at Oregon Plant in U.S.) |
(Oki LSI Technology Kansai established) |
|
| 1991 |
(M3 Plant completed at Miyazaki Oki Electric) |
| 1992 |
(Operations begun at Thailand Plant) |
ULSI Laboratory No.1 completed |
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Production of 16 Mb DRAMs (0.5μm design rules used) |
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| 1994 |
256Mb DRAMs (0.25μm design rules used) successfully developed |
| 1995 |
(S2 Plant completed at Miyazaki Oki Electric) |
Production of SSD cards |
|
| 1996 |
New Cafeteria Building completed (Building No.6) |
| 1997 |
New Administration/Technology Center completed (Building No.7) |
Production of 64Mb DRAMs (0.3μm design rules used) |
|
1Gb DRAMs (0.18μm design rules used) successfully developed |
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| 1998 |
Business based SPA started |
Surface-mount Optical Network Modules commercialized |
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USB Control LSIs commercialized |
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| 2000 |
Bluetooth System LSIs commercialized |
μPLAT developed |
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| 2002 |
Production of LSIs using Fully Depleted SOI-CMOS technology |
| 2003 |
Long-Wave Time Code Receiver based on SOI-CMOS technology successfully developed, an industry first |
| 2004 |
Semiconductor Bases in Shenzhen, Beijing and Shanghai established |
| 2005 |
Semiconductor Business Group established |
| 2007 |
Silicon Microdevice Company established |
| 2008 |
OKI SEMICONDUCTOR CO.,LTD. established |