ASIC W-CSP Technology Advantages

Engineers are looking for application driven small form factor packaging that can used for complex feature and functionality rich System On Chip designs.

Additional requirements include high performance, ultra-thin, ultra-light weight
characteristics.

Oki's offers an ASIC packaging choice W-CSP which is 50 percent of the size of the fine pitch BGA and 25 percent of the fine pitch QFP package for the same pin counts.

Oki's ASIC W-CSP package choice supports the small form, factor requirements of designs like cell phones, GPS systems, PCMCIA cards, wireless LANS and other mobile applications.
Oki's W-CSP packaging has a 30% shorter lead time than conventional packaging to reduce your overall ASIC design timeline.

Technical overview of the ASIC W-CSP process