MP3 Decoder LSIs
| ML2011 - World's Smallest Package MP3 Decoder LSI | |
ML2011 integrates an MP3 decoder and speaker amplifier in a single chip with wafer level chip size packaging (W-CSP), achieving the world's smallest package of 3.6 x 4.2mm. In addition to the LSIs, Oki provides a reference board and a sample of its embedding software enabling users to achieve MP3 systems easily.
As the use of digital audio players and mobile phones equipped with music playback functions grows, demands for systems equipped with digital audio functions, such as MP3, has also been increasing. Oki successfully integrates the speaker amplifier, achieving a highly functional, low cost chip with the smallest size packaging in the world.
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Oki's ML2011 is compliant with all MP3 formats including MPEG 1 Audio Layer III, MPEG 2 Audio Layer III and MPEG2.5, enabling users to replay a wide range of sounds from fully compressed voice to high-quality music. The 8ohm speaker amplifier has an output of 650mW and is designed to operate on 5V. Naturally, the chip is compliant with the MP3 decoder. It comes in two sizes: the world's smallest packaging of 3.6mm x 4.2mm W-CSP, or a 5mm x 6mm QFN package for easy mounting. While a sound generator replays musical note files by combining pre-installed instrument sounds, the ML2011, because it is compliant with MP3, can replay both voice and vocals with music accompaniment. In addition, compared to speech LSIs, ML2011 provides better sound quality sound effects and can compress the data by 50%. |
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| ML2841 - World's Lowest Power Consumption Sound Chip for Mobile Phones, equipped with 64 Polyphonic Sound Generator and MP3 Decoder | |
ML2841, a sound chip equipped with a 64 polyphonic sound generator and an MP3 decoder. Oki succeeded in reducing the power consumption of long-period MP3 playback on mobile phones down to 32mW, a decrease of approximately 80% compared to previous products. Oki succeeded in reducing three notable parameters for the ML2841. First, it decreased the MP3 decoder power consumption from 57mW to 5mW. Secondly, by applying a digital amplifier, it reduced the headphone amplifier power consumption down to 32mW, an 80% decrease. Finally, it reduced the total cost by utilizing the mobile phone platform and optimizing specifications as necessary. With these achievements, Oki completed an experiment to play back music for 30 hours non-stop by connecting the chip to a GSM mobile phone platform and a 1000mAh battery. Theoretically, it can extend playback time to 60 hours by improving the software for the mobile phone platform. The chip consist of a low power consumption MP3 decoder, an SRS 3D surround, an equalizer and a 64 polyphonic sound generator. With a super-small package of 4.16 X 4.16mm, it is best suited to achieving audio functions on mobile phones. Oki also upgraded its tool to create multimedia communication data files (MCDF) compliant to be compliant with ML2841, which enables users to create their own multimedia content. The tool can be downloaded from: https://www.oki.com/jp/sisc/swingnringercp/ |
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| MP3 Decoder line-up |
| Part Number | Function | Format | Supply Voltage |
Active/Standby Current (typ.) |
Operating Temp | Packages | Product Status | |
|---|---|---|---|---|---|---|---|---|
| ML2841 new |
PI | MP3 decoder, 64 polyphony GM sound generator, SRS ™ 3D Surround, ADPCM/PCM decoder, Class D headphone amp, 5-band EQ, ultra-low power consumption | MPEG1/2/2.5 audio layer III | DVDD: +1.35V~+1.65V I/OVDD: +1.65V~+3.6V AVDD: +2.7V ~ +3.6V |
10mA (no load) /1µA | -20~ +85°C | WCSP49 | VP |
ML2011 |
PI | MP3 decoder with integrated speaker amplifier, low power consumption | MPEG1/2/2.5 audio layer III | DVDD: +2.7V ~ +3.6V I/OVDD: +1.65V~DVDD SPVDD: DVDD ~ +4.5V |
27mA (no load) /2µA | -20~ +85°C | QFN32, WCSP35 | VP |
Product Introduction (PI) sheets available per download above, full datasheets are available upon request from your local sales office or authorized distributor SRS and (●) symbol are trademarks of SRS Labs, Inc. in the United States and selected foreign countries |
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in a single chip with wafer level chip size packaging (W-CSP), achieving the world's smallest package of 3.6 x 4.2mm. In addition to the LSIs, Oki provides a reference board and a sample of its embedding software enabling users to achieve MP3 systems easily.

