Packaging Solutions

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Packaging Solutions

OKI's IC Package Technology for value-added applications

The objectives of the existing IC package technology are to protect the main body of ICs
from external environment and to mount ICs on boards. Currently, high-value addition
is requested to the package itself for effective mounting as a result of the expansion
of the application fields of IC products and diversified package materials,
sizes and shapes.

Therefore, in the IC development, package technology has been paid attention to as a
strategically important technology as well as design technology and process technology.
OKI contributes to customers with a wide array of package lineup and reliable technology
based on the past performance which has been achieved by our active efforts
in development of the package technology.

Package roadmap

OKI´s packaging roadmap

FBGA/FLGA

OKI´s FBGA and FLGA packaging technology Packages where a semiconductor chip is mounted on the glass epoxy substrate and is sealed with transfer mold after circuit wiring by wire bonding.
The pins are arranged on the bottom surface of the substrate in an area form.

OKI recommends FLGA using solder/Pb-free coated pins for packages with an external size of 10mm or less and FBGA using solder/Pb-free balls with an external size exceeding 10mm.

In each package, MCP (Multi Chip Package) using lamination structure can also be supported.

FBGA Family

Package Size	Pin Count	Pin Pitch	Pin Arrangement	Package Code	Status
6 x 6 mm	60pins	0.5 mm	2 rows in periphery	P-LFBGA64-0606-0.50	VP
7 x 7 mm	48pins	0.8 mm	2 rows in periphery	P-LFBGA48-0707-0.80	VP
8 x 8 mm	160pins	0.5 mm	4 rows in periphery	P-TFBGA160-0808-0.50	VP
9 x 9mm	84pins	0.8 mm	3 rows in periphery	P-LFBGA84-0909-0.80	VP
9 x 9 mm	120pins	0.65 mm	3 rows in periphery	P-TFBGA120-0909-0.65	VP
11 x 11 mm	144pins	0.8mm	4 rows in periphery	P-LFBGA144-1111-0.80	VP
11 x 11 mm	176pins	0.65 mm	4 rows in periphery	P-LFBGA176-1111-0.65	VP
13 x 13 mm	144pins	0.8mm	3 rows in periphery	P-LFBGA144-1313-0.80	VP
13 x 13 mm	224pins	0.65 mm	4 rows in periphery	P-LFBGA224-1313-0.65	VP
15 x 15 mm	224pins	0.8mm	4 rows in periphery	P-LFBGA224-1515-0.80	VP

Selection Guide

W-CSP Technology

RoHS lead-free packaging

Reflow profiles (pb-free and SnPb)

Page Navigation

# Package Roadmap

# FBGA/FLGA

# TCP/COF

FLGA Family

Package Size	Pin Count	Pin Pitch	Pin Arrangement	Package Code	Status
7 x 7 mm	48pins	0.8 mm	2 rows in periphery	P-TFLGA48-0707-0.80	VP
8 x 8 mm	56pins	0.8 mm	2 rows in periphery	P-TFLGA56-0808-0.80	VP
9 x 9 mm	84pins	0.8 mm	3 rows in periphery	P-TFLGA84-0909-0.80	VP

TCP/COF

Packages where traces are formed on a flexible tape using photolithograph technology and a semiconductor chip is mounted on the tape carrier using TAB (Tape Automated Bonding) technique.

Material thickness has been reduced to allow supply of COF packages which support fine pitches

OKI´s strong points for TCP and COF packaging options:

Patterning is applied to a tape substrate using thin copper foil, pin formation of 40μm and that of 35μm or less are possible for TCP (Tape Carrier Package) and COF (Chip On Film), respectively
The package thickness can be reduced to 1mm or less since IC chips are mounted directly on a tape substrate
Flexible structure of TCP allows fold-mounting
COF can be freely fold-mounted except its plastic sealed section